India's First Advanced 3d Chip Packaging Facility Will Be Built in Odisha

News Desk. News Nation 360: Chief Minister Mohan Charan Majhi and Union IT Minister Ashwini Vaishnaw conducted the groundbreaking ceremony for India's first Advanced 3D Glass Semiconductor Packaging Unit in Bhubaneswar on April 19, 2026, marking Odisha's historic entry into the global high-tech supply chain. The factory, which was founded by 3D Glass Solutions (3DGS) with a strategic investment of ₹1,943 crore, uses state-of-the-art glass substrate technology, supported by multinational behemoths like Intel, Lockheed Martin, and Applied Materials, to create high-performance chips for the defence, AI, and 5G industries. This innovative project, which was expedited after Union Cabinet approval, is anticipated to generate 2,500 direct and indirect jobs and reach an annual capacity of 50 million units, making Odisha the first state in India to host both a sophisticated 3D packaging facility and a compound semiconductor fabrication plant. The effort places Odisha firmly in the top tier of the global semiconductor ecosystem and marks a significant milestone for the Atmanirbhar Bharat goal in next-generation electronics manufacturing by bringing the most cutting-edge heterogeneous integration technology to Info Valley.